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Fracture Toughness Evaluation at the Interface of Universal Adhesives and Tooth Dentine Using Mini-Interfacial Fracture Toughness Test Publisher



Sanaee Y1 ; Shekofteh K2 ; Albakhakh B3 ; Hooshmand T2, 4 ; Hashemian A4 ; Nouri A2 ; Behroozibakhsh M2, 4
Authors
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Authors Affiliations
  1. 1. Department of Orthodontics, School of Dentistry, Tehran University of Medical Sciences, Tehran, Iran
  2. 2. Department of Dental Biomaterials, School of Dentistry, Tehran University of Medical Sciences, Tehran, Iran
  3. 3. Department of Conservative, College of Dentistry, University of Almaaqal, Basrah, Iraq
  4. 4. Dental Research Center, Dentistry Research Institute, Tehran University of Medical Sciences, Tehran, Iran

Source: Journal of Adhesion Science and Technology Published:2025


Abstract

Using a modified mini-interfacial fracture toughness test (mini-IFT) and a designed mould for notch preparation, this study assessed the bonding effectiveness of self-etch universal adhesive systems. A total of 20 selected non-carious third molars were divided into four groups; G1: Clearfil SE Bond, G2: Clearfil S3 Bond Plus, G3: 3 M-Single bond Universal, G4: Ivoclar Tetric N-Bond Universal. The teeth were sectioned to obtain 1.5 × 2 mm wide longitudinal rectangular sections. A single notch then was prepared at the adhesive/dentine interface using a designed mould. The mini-iFT test was done via a 4-point bend testing until failure and the KIC was calculated. All specimens were observed using SEM. The data of each experimental group were analysed using one-way analysis of variance (ANOVA) and Weibull analysis. The results of one-way ANOVA did not indicate a significant difference between the four study groups (p > 0.05). The Weibull analysis showed that the characteristic strength of the groups ranges from 1.20 MPa to 1.39 MPa. The Weibull modulus m showed almost a similar plot in all study groups. According to SEM observations, the mode of failure for all samples was considered adhesive. Based on the results, the differences in mean mini-iFT values between the UAs and conventional self-etch adhesive group were not statistically significant. However, based on the left-censored data and the sample loss before and during the aging process, SE-bond showed better bonding quality than UAs. The low Weibull modulus in this study indicates nonuniform notches. More studies are needed to develop a repeatable and feasible method for preparing equal notches in mini-IFT test. © 2024 Informa UK Limited, trading as Taylor & Francis Group.